Lipampiri tsa Letlapa la PFA

Raw Materials: DuPont PFA resin (USA), e hlahisitsoeng ka har'a thupelo e hloekileng ea Sehlopha sa 10,000 ho netefatsa bohloeki bo phahameng ba Leqephe la lining (ho ikamahanya le litlhoko tsa semiconductor{2}}grade).
Tshebetso: RANA e hlahisa ka 9,000㎡ PPB/PPT-e hlwekileng maemong a thuto mme e amohela "hot{3}}press melting" ts'ebetso ea ho bopa, ho qoba tšilafalo ea likaroloana nakong ea tlhahiso le ho netefatsa bohloeki ba Leqephe la lesela.

Moko: Litšobotsi tsa "bohloeki bo phahameng + bo phahameng ba ho hanyetsa kutu" tsa PFA li e etsa hore e be thepa e ratoang haholo bakeng sa lisebelisoa tsa semiconductor tse phahameng-, ho qoba ho silafala ha li-ion tsa mecha ea litaba (mohlala, elektroniki{4}}hydrogen peroxide) le ho netefatsa tlhahiso e tlase ea lihlahisoa.
Melemo: E netefalitsoe ke SMIC, li-ion tsa tšepe li Ka tlase ho kapa li lekana le 0.05ppb ka mor'a ho boloka elektroniki-grade hydrogen peroxide (indasteri standard 0.1ppb), e nang le maemo a hanyetsanang le mocheso a likhato tse -200 ho isa ho 260 degrees . E le setho sa Mokhatlo oa China Semiconductor Industry Association, sehlahisoa se fetisitse litifikeiti tse tiileng ke SMIC, BOE le likhoebo tse ling.

Maemo a Kopo: E sebelisoa ka har'a lisebelisoa tsa semiconductor tse phahameng-tse hloekileng (mohlala, -litanka tsa polokelo tsa elektroniki tsa hydrofluoric acid) le lisebelisoa tse hloekisitsoeng tsa meriana (mohlala, litanka tsa polokelo ea lintho tse phelang) tse hlokang bohloeki bo phahameng le bohloeki bo phahameng. E thusitse bareki ho ntlafatsa tlhahiso ea chip (mohlala, tlhahiso ea 12-inch wafer e eketsehile ka 2%) le ho fokotsa tahlehelo ea lihlahisoa tse bakoang ke litšila.

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